Applied Infrared Lamp Technology ...improving component quality and reliability while minimizing environmental impact.
Introduction
METFAB's Reflow Systems use state-of-the-art short wave infrared lamp technology to produce improved component quality and reliability when incorporated into production lines to reflow plated tin and tin alloys. Simple temperature adjustment allows the accommodation of a wide range of part configurations and tin alloys. The result is a bright mirror like finish with excellent solderability characteristics and the lower likelihood of whisker development with age.
  Benefits
• Improved solderability
• Dense and porosity free coatings
• Slower intermetallic formation
• Reduced surface oxidation
• Uniform distribution
• Extended shelf life
• Prevents whisker formation
• Improved insertion force
• Excellent formability during   stamping
  Features
•  Modular construction
•  High efficiency gold reflector lamps
•  Independent lamp intensity adjustments
•  Long lamp life
  Application
•  METFAB reflow systems are recommended for the post treatment of electroplated tin, solder and other    tin alloys    on strip and stamped components.
•  Each system is configured to match the range of line speeds and components likely to be    encountered.
•  Modules can be provided as part of complete new systems or as retrofits to existing lines.
•  Single and multiple strand models are available.
Theory
Electroplated tin, solder and other tin alloys have been used for years as a final finish for electronic components that are soldered or inserted into the final locations. The quality of those finishes effects the life and performance the component and ultimately the device. Deposit porosity and solderability have always been key parameters in determining product quality and predicting the useful life.

It has been determined that reflowing or melting the electroplated finish after application significantly improves its functionality.

A very pure, dense, porosity-free structure is formed that exhibits slower copper-tin intermetallic compound growth and reduced surface oxidation. Both improve solderability.

Reflow also improves the uniformity of tin distribution in the deposit. This results in lower required insertion forces during assembly and excellent formability in post plate stamping operations.

Conventionally electroplated finishes exhibit "whisker" formation as the finish ages. Whiskers can cause electrical short circuits that may result in loss of product reliability and premature device failure.

Reflow of the deposits prior to assembly greatly retards or eliminates whisker formation.

Ⓒ2008 METFAB Technologies, Inc.